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TSOP Component Package

Authors:
Geoffrey Hunter
Geoffrey Hunter
Published On:
Apr 7, 2026
Last Updated:
Apr 7, 2026

TSOP (Thin Small Outline Package) is a family of surface-mount molded IC packages with gull-wing leads. They are very thin (with a height of approx. 1 mm) and have pitches from approx. 0.50 - 1.20 mm.1

TSOP comes in two variants:1

  • Type I (TSOP1): Pins are on the shorter side of the package.
  • Type II (TSOP2): Pins are on the longer side of the package.

The Type II package appears to be the more common variant. Unfortunately, many manufacturers do not distinguish between the two types in the package name.

A 3D render of the TSOP-48 (Type I) component package of the Micron Technology MT29F1G08ABAFAWP-AAT:F flash memory.2
A photo of the Everspin Technologies MR2A16A MRAM memory in the TSOP-44 (Type II) component package.3

TSOP pin counts are usually between 20 and 56.

Synonyms:

  • TSOP-2: Type II TSOP package.

Examples

TSOP1-48: Body width (between the two edges with leads) is 18.40 mm (0.724”). Body length is 12.20 mm (0.480”). Pitch is 0.50 mm (0.0197”). TSOP2-44: Body width (between the two edges with leads) is 10.16 mm (0.400”). Body length is 18.81 mm (0.741”). Pitch is 0.80 mm (0.0315”).

Common Uses

TSOP is a very popular package for memory ICs.

Similar To

  • SOIC (small outline integrated circuit): SOIC is another plastic, gull-wing, two-row SMD component package. However, SOIC is used for a wider range of devices (e.g. general purpose logic, small ICs), and almost always has a 1.27 mm pitch, compared to the variable pitches of TSOP package family. SOIC packages typically have fewer pins, generally between 4 and 28.
  • TSSOP (thin shrink small outline package): Thinner and smaller than TSOP for the same lead count. Some TSSOP packages have an exposed pad for heatsinking.

Footnotes

  1. Wikipedia (2025, Sep 6). Thin small outline package. Retrieved 2026-04-07, from https://en.wikipedia.org/wiki/Thin_small_outline_package. ↩ ↩2

  2. DigiKey. Micron Technology Inc. MT29F1G08ABAFAWP-AAT:F [product page]. Retrieved 2026-04-07, from https://www.digikey.co.nz/en/products/detail/micron-technology-inc/MT29F1G08ABAFAWP-AAT:F/11591678. ↩

  3. Everspin Technologies (2018). MR2A16A - 256K x 16 MRAM Memory [datasheet]. Retrieved 2026-04-07, from https://www.everspin.com/file/156628/download. ↩